verion veron0.1 features and benefits ? thin package:1.3mm typ, 1.4mm max. ? small footprint:8.2mm x 8.4mm ? multiple power-save modes to maximize battery life ? advanced security ? bluetooth active signaling interface for optimum packet efficiency ? qos packet prioritization for time sensitive payload ? os support for windows mobile, linux ? wlan sdio / spi host interfaces wlan product brief LBWA18HEPZ wlan 802.11b/g module the LBWA18HEPZ is an i eee 802.11b/g wireless lan module requiring just 64 square millimeters of host pcb area. integrated within th e module are a host of active and passive components resulting in a single simple package for the customer. on module components include the wlan chip, eeprom, ldo regulator, driver and power amplif ier, crystal, balun, and spdt switch, the feature set for wlan include s ieee 802.11i security, quality of service (qos) traffic prioritization for voip and multimedia applications, an ultra low power sl eep mode. an internal bluetooth signaling interface along with afh is utilized for enhanced co- existence for the two radios who share the same 2.4 ghz spectrum. this module is targeted to c onsumer electronics where high integration, proven coexistence, an d fast design cycles are highly valued. the module integrates the latest si licon technology for mobile client wireless lan offering the best fe ature set while minimizing space and power consumption. this module utilizes a qfn packag e and allows direct attachment to the main printed circuit board utilizing industry standard surface mount technology processing for high volume production. corporate headquarters parkway centre ii 2805 north dallas parkway, suite 400 plano, tx 75093 u. s. a. tel: (1) 972-202-8888 ? fax: (1) 972-633-0327
verion veron0.1 \ LBWA18HEPZ block diagram specifications: ? standards conformance: 802.11b/g wlan ? frequency range: 2.4 to 2.5 ghz ? operational voltage range: 3.3vdc ? wlan host interface: 1.8 or 3.3vdc ? wlan rf power: +15dbm 54 to 1 mbps ? receiver sensitivity: -70dbm typ 54mbps, -91dbm typ 11mbps ? power down current: 180 ua ? receive dc current: 175 ma ? transmit dc current: 300 ma ? physical dimensions: 8.2mm x 8.4mm x 1.3mm ? rf interfaces: pcb pad ? wlan host interfaces: sdio, spi visit our website: www.sychip.com corporate headquarters parkway centre ii 2805 north dallas parkway, suite 400 plano, tx 75093 u. s. a. tel: (1) 972-202-8888 ? fax: (1) 972-633-0327
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